SiC CMP Equipment Market, Global Outlook and Forecast 2024-2030

MARKET INSIGHTS

The global SiC CMP Equipment market size was valued at USD 166 million in 2023. The market is projected to grow from USD 201 million in 2025 to USD 559 million by 2030, exhibiting a remarkable CAGR of 21.2% during the forecast period. This accelerated growth trajectory reflects the increasing adoption of silicon carbide in power electronics and semiconductor applications.

SiC CMP (Chemical Mechanical Polishing) equipment is critical for manufacturing high-performance silicon carbide wafers. These precision systems utilize both chemical and mechanical forces to achieve ultra-smooth, defect-free wafer surfaces essential for semiconductor fabrication. The process is particularly crucial for SiC substrates because of their inherent hardness (second only to diamonds), requiring specialized equipment capable of handling this challenging material while maintaining nanoscale surface accuracy.

The market expansion is being driven by several key factors: surging demand for electric vehicles and 5G infrastructure (both heavily reliant on SiC power devices), technological advancements in semiconductor manufacturing, and growing investments in wide bandgap materials. While North America currently leads in technological innovation, Asia-Pacific is emerging as the fastest-growing region due to rapid semiconductor industry expansion, particularly in China where domestic manufacturers are actively developing 150mm and 200mm SiC wafer capabilities.

MARKET DYNAMICS

MARKET DRIVERS

Growing Demand for SiC Power Devices in Electric Vehicles to Accelerate Market Adoption

The rapid expansion of electric vehicle (EV) production is creating unprecedented demand for silicon carbide (SiC) power devices, which in turn drives the need for advanced SiC CMP equipment. SiC semiconductors offer superior thermal conductivity and energy efficiency compared to traditional silicon, making them ideal for EV power systems. Major automotive manufacturers are rapidly transitioning to SiC-based solutions, with production forecasts indicating a compound annual growth rate exceeding 30% for SiC components in the automotive sector through 2030. This surge directly correlates to increased requirements for high-precision wafer polishing solutions that can meet the stringent quality standards of automotive-grade semiconductors.

Expansion of 5G Infrastructure and Renewable Energy Systems Fuels Equipment Demand

The global rollout of 5G networks and renewable energy systems is creating significant opportunities for SiC semiconductor applications. These technologies require power devices that can operate at higher frequencies and voltages while maintaining efficiency - performance characteristics where SiC excels. Investment in 5G infrastructure is projected to surpass $300 billion annually by 2025, with each base station requiring multiple SiC power devices. Similarly, solar inverters utilizing SiC technology demonstrate 50% lower energy losses compared to conventional silicon solutions. As these industries scale, the need for reliable, high-throughput SiC wafer polishing solutions becomes increasingly critical throughout the supply chain.

➤ Leading manufacturers are responding to this demand with new 200mm wafer processing capabilities, as the industry shifts toward larger diameter substrates to improve production economics.

Furthermore, government initiatives supporting semiconductor independence and clean energy transitions are providing additional momentum. Numerous countries have implemented policies and funding programs aimed at strengthening domestic semiconductor manufacturing capabilities, particularly for advanced materials like silicon carbide.

MARKET RESTRAINTS

High Capital Costs and Complex Process Requirements Limit Market Penetration

The specialized nature of SiC CMP equipment presents significant barriers to market entry and expansion. A single advanced CMP tool can cost between $2-4 million, requiring substantial upfront investment from semiconductor manufacturers. Moreover, the polishing process for SiC wafers is considerably more complex than for traditional silicon, often requiring proprietary slurry formulations and specialized conditioning systems. These factors combine to create a high total cost of ownership that can deter smaller players and new market entrants from adopting the latest CMP technologies.

Additional Constraints

Yield Challenges
The extreme hardness of silicon carbide (9.5 Mohs) compared to silicon (7 Mohs) significantly increases polishing times and introduces yield challenges. Achieving the required surface finish often requires multiple polishing steps, with typical process times 3-5x longer than for silicon wafers. This extended processing directly impacts production throughput and overall equipment effectiveness metrics.

Supply Chain Limitations
The specialized components required for SiC CMP systems, including diamond-coated platens and advanced slurry delivery mechanisms, face occasional supply chain disruptions. These bottlenecks can delay equipment deliveries by several months, affecting manufacturers' ability to scale production in response to growing demand.

MARKET CHALLENGES

Technical Complexity of SiC Polishing Creates Process Integration Hurdles

The material properties of silicon carbide present unique challenges for chemical mechanical planarization. Unlike silicon wafers which polish relatively uniformly, SiC exhibits anisotropic removal rates that vary significantly based on crystal orientation. This characteristic demands advanced process control systems capable of maintaining consistent removal rates across the entire wafer surface. Current limitations in real-time polishing monitoring technology sometimes result in non-uniform surfaces that require additional rework or lead to wafer rejection.

Workforce Development Issues
The specialized knowledge required to operate and maintain SiC CMP equipment exceeds that needed for conventional silicon processing. This creates a talent gap in the industry, with semiconductor manufacturers reporting difficulty finding technicians experienced in SiC-specific process challenges. Training programs have not kept pace with market growth, resulting in extended equipment qualification periods and increased operational costs for new production lines.

MARKET OPPORTUNITIES

Advancements in CMP Technology to Enable Next-Generation SiC Applications

The development of novel CMP techniques specifically optimized for SiC presents significant growth opportunities. Emerging solutions combining advanced slurry chemistry with intelligent polishing head designs are demonstrating removal rate improvements of 40-60% compared to conventional approaches. These innovations are particularly critical as the industry transitions to 200mm wafer processing, where existing technologies struggle with consistency across larger substrate areas. Early adopters of these next-generation systems are achieving substantial competitive advantages in production efficiency and yield quality.

Vertical Integration Strategies Create New Market Possibilities

Leading equipment manufacturers are pursuing vertical integration strategies to capture more value across the SiC production chain. By combining CMP systems with complementary technologies like laser dicing and metrology solutions, companies can offer complete process solutions that streamline customer operations. This trend is particularly evident in strategic partnerships between equipment vendors and materials suppliers, enabling tighter process control from substrate to finished device. Such integrated approaches are expected to become increasingly important as SiC adoption expands into mass-market applications requiring tighter cost controls.

Additionally, the growing emphasis on sustainable semiconductor manufacturing is driving innovation in CMP system design. New equipment iterations are demonstrating 30-40% reductions in water and chemical consumption while maintaining or improving polishing performance, addressing both environmental concerns and operational cost pressures simultaneously.

Segment Analysis:

By Type

150 mm SiC Wafer Segment Leads Due to High Adoption in Semiconductor Fabrication

The market is segmented based on type into:

• 150 mm SiC Wafer

• 200 mm SiC Wafer

• Others

By Application

SiC Power Device Segment Drives Market Growth With Increasing Demand in Energy Sector

The market is segmented based on application into:

• SiC Power Device

• RF Devices

• LED Manufacturing

• Others

By End User

Semiconductor Foundries Lead Adoption Due to High-Volume Production Requirements

The market is segmented based on end user into:

• Semiconductor Foundries

• IDMs (Integrated Device Manufacturers)

• Research Institutions

COMPETITIVE LANDSCAPE

Key Industry Players

Technological Innovation and Strategic Expansion Define Market Competition

The global SiC CMP Equipment market features a moderately consolidated landscape, dominated by established semiconductor equipment manufacturers and specialized polishing solution providers. Applied Materials (AMAT) leads the market share, leveraging its extensive R&D capabilities and established relationships with major semiconductor foundries. The company's CMP platforms specifically optimized for SiC wafer processing have become industry benchmarks for throughput and process control.

EBARA Corporation and Axus Technology follow closely, each holding significant market positions. EBARA's strength lies in its precision fluid handling systems critical for CMP processes, while Axus has gained recognition for its specialized wafer handling solutions in harsh processing environments. Both companies are actively expanding their manufacturing capacities across Asia to meet growing demand from electric vehicle and power electronics manufacturers.

The market also sees strong competition from regional players like Beijing Semicore Microelectronics Equipment in China and Hwatsing Technology, who are gaining traction through government-supported semiconductor independence initiatives. These domestic manufacturers are rapidly closing the technology gap through joint development programs with local universities and strategic technology transfers.

Recent market developments highlight the accelerating transition to 200mm wafer processing, with key players investing heavily in next-generation CMP systems capable of handling larger SiC substrates. This technological shift is creating both opportunities and challenges, as equipment manufacturers must balance performance improvements with the need for backward compatibility with existing 150mm production lines.

List of Key SiC CMP Equipment Manufacturers

• Applied Materials, Inc. (U.S.)

• EBARA Corporation (Japan)

• Axus Technology (U.S.)

• ACCRETECH (Japan)

• Beijing Semicore Microelectronics Equipment Co., Ltd. (China)

• Hwatsing Technology (China)

SiC CMP EQUIPMENT MARKET TRENDS

Adoption of 200mm SiC Wafers as a Key Trend in Market Expansion

The shift toward larger wafer sizes, particularly 200mm SiC wafers, is transforming the SiC CMP equipment market. The semiconductor industry is increasingly transitioning from 150mm to 200mm wafers due to their enhanced throughput and cost efficiency in high-volume production environments. This transition necessitates advanced CMP equipment capable of handling larger diameters while maintaining ultra-high surface uniformity—critical for power device applications. Manufacturers are investing heavily in next-generation polishing technologies to address the stringent requirements of SiC power devices, which now account for over 60% of the market demand.

Other Trends

Demand Surge from Electric Vehicle (EV) Sector

The rapid adoption of electric vehicles (EVs) is driving unprecedented demand for SiC-based power electronics. Components like inverters, onboard chargers, and traction systems rely on SiC wafers polished to sub-nanometer smoothness to optimize energy efficiency and thermal performance. With projections indicating EV sales growth at a CAGR of 25% through 2030, this segment is expected to become the dominant end-user for SiC CMP equipment, accelerating market expansion beyond its current $166 million valuation.

Geopolitical Factors and Supply Chain Localization

Geopolitical tensions and semiconductor supply chain vulnerabilities are prompting regional investments in localized SiC production. Governments in North America and Europe are incentivizing domestic manufacturing with initiatives like the U.S. CHIPS Act and the European Chips Act, collectively allocating over $100 billion toward semiconductor self-sufficiency. This trend is expanding markets for SiC CMP equipment manufacturers, particularly in regions like China, which aims to control 30% of the global SiC supply chain by 2025. Meanwhile, equipment vendors are adapting to dual-supply strategies to navigate trade restrictions.

Technological advancements in multi-step polishing processes are further refining wafer quality standards. Innovations such as endpoint detection systems and AI-driven process optimization reduce material waste by up to 15%, addressing one of the key cost challenges in SiC manufacturing. As the market grows toward $559 million by 2030, these developments will play a pivotal role in maintaining competitiveness amid rising material and energy costs.

Regional Analysis: SiC CMP Equipment Market

North America
The North American market for SiC CMP equipment is driven by strong semiconductor R&D investments and the rapid adoption of Silicon Carbide (SiC) technology in power electronics. The U.S. leads the region, fueled by heavy investments from key players like Wolfspeed, ON Semiconductor, and II-VI Incorporated, all focusing on expanding SiC production capabilities. The CHIPS and Science Act, which includes $52 billion for semiconductor manufacturing and research, is accelerating demand for precision polishing equipment. Additionally, stringent quality standards in aerospace, defense, and electric vehicle manufacturing necessitate the use of high-performance SiC CMP equipment to ensure ultra-smooth, defect-free wafers. However, the region faces challenges such as supply chain constraints and high equipment costs, which could slow adoption in smaller enterprises.

Europe
Europe emphasizes sustainable and precision-driven semiconductor manufacturing, supporting the demand for advanced SiC CMP solutions. Germany, France, and the Nordic countries are key contributors, driven by their thriving automotive and industrial sectors transitioning to SiC-based power electronics. The European Union’s Green Deal and Horizon Europe initiatives encourage innovation in semiconductor technologies, including SiC. Leading manufacturers like Infineon and STMicroelectronics are expanding their SiC wafer production, further boosting the need for precision polishing equipment. However, slow regulatory approvals and a fragmented supply chain could impede market growth, though long-term investments in clean energy and EVs position the region for steady expansion.

Asia-Pacific
The dominant market for SiC CMP equipment, Asia-Pacific benefits from China, Japan, South Korea, and Taiwan leading semiconductor production and SiC adoption. China, in particular, has aggressively scaled SiC wafer manufacturing, with government-backed initiatives and heavy investments from domestic players like SICC Co. and HestiaPower. Japan and South Korea remain strong due to their legacy in semiconductor manufacturing, with companies like ROHM and SK Siltron pushing for SiC-based power device advancements. While cost competition is intense, the shift toward 200 mm SiC wafers is driving upgrades in CMP equipment. However, geopolitical tensions and export restrictions could disrupt supply chains in the region.

South America
The market in South America is nascent but growing, with Brazil leading due to increasing investments in renewables and power electronics. The region’s automotive and energy sectors are gradually adopting SiC technology, creating opportunities for CMP equipment suppliers. However, economic instability, limited semiconductor infrastructure, and reliance on imports hinder faster market penetration. While local production remains minimal, partnerships with global manufacturers could unlock potential in the coming years.

Middle East & Africa
SiC CMP equipment demand in this region is emerging slowly, driven primarily by Saudi Arabia and the UAE, where governments are investing in sustainable energy and industrial diversification. While the market is small compared to other regions, long-term infrastructure projects and smart city initiatives could drive SiC adoption. Challenges include limited local expertise, high import dependency, and underdeveloped semiconductor ecosystems, but strategic collaborations with international firms may spur future growth.

Report Scope

This market research report offers a holistic overview of global and regional markets for the forecast period 2025–2030. It presents accurate and actionable insights based on a blend of primary and secondary research.

Key Coverage Areas:

• ✅ Market Overview

  • Global and regional market size (historical & forecast)

  • Growth trends and value/volume projections

• ✅ Segmentation Analysis

  • By product type or category

  • By application or usage area

  • By end-user industry

  • By distribution channel (if applicable)

• ✅ Regional Insights

  • North America, Europe, Asia-Pacific, Latin America, Middle East & Africa

  • Country-level data for key markets

• ✅ Competitive Landscape

  • Company profiles and market share analysis

  • Key strategies: M&A, partnerships, expansions

  • Product portfolio and pricing strategies

• ✅ Technology & Innovation

  • Emerging technologies and R&D trends

  • Automation, digitalization, sustainability initiatives

  • Impact of AI, IoT, or other disruptors (where applicable)

• ✅ Market Dynamics

  • Key drivers supporting market growth

  • Restraints and potential risk factors

  • Supply chain trends and challenges

• ✅ Opportunities & Recommendations

  • High-growth segments

  • Investment hotspots

  • Strategic suggestions for stakeholders

• ✅ Stakeholder Insights

  • Target audience includes manufacturers, suppliers, distributors, investors, regulators, and policymakers

FREQUENTLY ASKED QUESTIONS:

What is the current market size of Global SiC CMP Equipment Market?

-> The Global SiC CMP Equipment market was valued at USD 166 million in 2023 and is projected to reach USD 559 million by 2030.

Which key companies operate in Global SiC CMP Equipment Market?

-> Key players include AMAT, EBARA, Axus Technology, ACCRETECH, Beijing Semicore Microelectronics Equipment Co., Ltd, and Hwatsing Technology.

What are the key growth drivers?

-> Key growth drivers include rising demand for SiC power devices, increasing semiconductor manufacturing investments, and technological advancements in wafer polishing.

Which region dominates the market?

-> Asia-Pacific is the fastest-growing region, while North America maintains significant market share.

What are the emerging trends?

-> Emerging trends include transition to 200mm wafer processing, automation in CMP systems, and development of eco-friendly polishing solutions.