This report aims to provide a comprehensive presentation of the global market for Fan-out Panel-level Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fan-out Panel-level Packaging. This report contains market size and forecasts of Fan-out Panel-level Packaging in global, including the following market information:
Global Fan-out Panel-level Packaging Market Revenue, 2018-2023, 2024-2030, ($ millions)
Global top five companies in 2022 (%)
The global Fan-out Panel-level Packaging market was valued at US$ 1409.5 million in 2022 and is projected to reach US$ 4721.9 million by 2030, at a CAGR of 18.9% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is to reach $ Million.
System-in-package (SiP) Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Fan-out Panel-level Packaging include Amkor Technology, Deca Technologies, Lam Research Corporation, Qualcomm Technologies, Siliconware Precision Industries, SPTS Technologies, STATS ChipPAC, Samsung and TSMC, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Fan-out Panel-level Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Fan-out Panel-level Packaging Market, by Type, 2018-2023, 2024-2030 ($ millions)
Global Fan-out Panel-level Packaging Market Segment Percentages, by Type, 2022 (%)
System-in-package (SiP)
Heterogeneous Integration
Global Fan-out Panel-level Packaging Market, by Application, 2018-2023, 2024-2030 ($ millions)
Global Fan-out Panel-level Packaging Market Segment Percentages, by Application, 2022 (%)
Wireless Devices
Power Management Units
Radar Devices
Processing Units
Others
Global Fan-out Panel-level Packaging Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions)
Global Fan-out Panel-level Packaging Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Fan-out Panel-level Packaging revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Fan-out Panel-level Packaging revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Amkor Technology
Deca Technologies
Lam Research Corporation
Qualcomm Technologies
Siliconware Precision Industries
SPTS Technologies
STATS ChipPAC
Samsung
TSMC
Outline of Major Chapters:
Chapter 1: Introduces the definition of Fan-out Panel-level Packaging, market overview.
Chapter 2: Global Fan-out Panel-level Packaging market size in revenue.
Chapter 3: Detailed analysis of Fan-out Panel-level Packaging company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Fan-out Panel-level Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
TABLE OF CONTENTS
1 Introduction to Research & Analysis Reports
1.1 Fan-out Panel-level Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Fan-out Panel-level Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Fan-out Panel-level Packaging Overall Market Size
2.1 Global Fan-out Panel-level Packaging Market Size: 2022 VS 2030
2.2 Global Fan-out Panel-level Packaging Market Size, Prospects & Forecasts: 2018-2030
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top Fan-out Panel-level Packaging Players in Global Market
3.2 Top Global Fan-out Panel-level Packaging Companies Ranked by Revenue
3.3 Global Fan-out Panel-level Packaging Revenue by Companies
3.4 Top 3 and Top 5 Fan-out Panel-level Packaging Companies in Global Market, by Revenue in 2022
3.5 Global Companies Fan-out Panel-level Packaging Product Type
3.6 Tier 1, Tier 2 and Tier 3 Fan-out Panel-level Packaging Players in Global Market
3.6.1 List of Global Tier 1 Fan-out Panel-level Packaging Companies
3.6.2 List of Global Tier 2 and Tier 3 Fan-out Panel-level Packaging Companies
4 Market Sights by Product
4.1 Overview
4.1.1 By Type - Global Fan-out Panel-level Packaging Market Size Markets, 2022 & 2030
4.1.2 System-in-package (SiP)
4.1.3 Heterogeneous Integration
4.2 By Type - Global Fan-out Panel-level Packaging Revenue & Forecasts
4.2.1 By Type - Global Fan-out Panel-level Packaging Revenue, 2018-2023
4.2.2 By Type - Global Fan-out Panel-level Packaging Revenue, 2024-2030
4.2.3 By Type - Global Fan-out Panel-level Packaging Revenue Market Share, 2018-2030
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global Fan-out Panel-level Packaging Market Size, 2022 & 2030
5.1.2 Wireless Devices
5.1.3 Power Management Units
5.1.4 Radar Devices
5.1.5 Processing Units
5.1.6 Others
5.2 By Application - Global Fan-out Panel-level Packaging Revenue & Forecasts
5.2.1 By Application - Global Fan-out Panel-level Packaging Revenue, 2018-2023
5.2.2 By Application - Global Fan-out Panel-level Packaging Revenue, 2024-2030
5.2.3 By Application - Global Fan-out Panel-level Packaging Revenue Market Share, 2018-2030
6 Sights by Region
6.1 By Region - Global Fan-out Panel-level Packaging Market Size, 2022 & 2030
6.2 By Region - Global Fan-out Panel-level Packaging Revenue & Forecasts
6.2.1 By Region - Global Fan-out Panel-level Packaging Revenue, 2018-2023
6.2.2 By Region - Global Fan-out Panel-level Packaging Revenue, 2024-2030
6.2.3 By Region - Global Fan-out Panel-level Packaging Revenue Market Share, 2018-2030
6.3 North America
6.3.1 By Country - North America Fan-out Panel-level Packaging Revenue, 2018-2030
6.3.2 US Fan-out Panel-level Packaging Market Size, 2018-2030
6.3.3 Canada Fan-out Panel-level Packaging Market Size, 2018-2030
6.3.4 Mexico Fan-out Panel-level Packaging Market Size, 2018-2030
6.4 Europe
6.4.1 By Country - Europe Fan-out Panel-level Packaging Revenue, 2018-2030
6.4.2 Germany Fan-out Panel-level Packaging Market Size, 2018-2030
6.4.3 France Fan-out Panel-level Packaging Market Size, 2018-2030
6.4.4 U.K. Fan-out Panel-level Packaging Market Size, 2018-2030
6.4.5 Italy Fan-out Panel-level Packaging Market Size, 2018-2030
6.4.6 Russia Fan-out Panel-level Packaging Market Size, 2018-2030
6.4.7 Nordic Countries Fan-out Panel-level Packaging Market Size, 2018-2030
6.4.8 Benelux Fan-out Panel-level Packaging Market Size, 2018-2030
6.5 Asia
6.5.1 By Region - Asia Fan-out Panel-level Packaging Revenue, 2018-2030
6.5.2 China Fan-out Panel-level Packaging Market Size, 2018-2030
6.5.3 Japan Fan-out Panel-level Packaging Market Size, 2018-2030
6.5.4 South Korea Fan-out Panel-level Packaging Market Size, 2018-2030
6.5.5 Southeast Asia Fan-out Panel-level Packaging Market Size, 2018-2030
6.5.6 India Fan-out Panel-level Packaging Market Size, 2018-2030
6.6 South America
6.6.1 By Country - South America Fan-out Panel-level Packaging Revenue, 2018-2030
6.6.2 Brazil Fan-out Panel-level Packaging Market Size, 2018-2030
6.6.3 Argentina Fan-out Panel-level Packaging Market Size, 2018-2030
6.7 Middle East & Africa
6.7.1 By Country - Middle East & Africa Fan-out Panel-level Packaging Revenue, 2018-2030
6.7.2 Turkey Fan-out Panel-level Packaging Market Size, 2018-2030
6.7.3 Israel Fan-out Panel-level Packaging Market Size, 2018-2030
6.7.4 Saudi Arabia Fan-out Panel-level Packaging Market Size, 2018-2030
6.7.5 UAE Fan-out Panel-level Packaging Market Size, 2018-2030
7 Fan-out Panel-level Packaging Companies Profiles
7.1 Amkor Technology
7.1.1 Amkor Technology Company Summary
7.1.2 Amkor Technology Business Overview
7.1.3 Amkor Technology Fan-out Panel-level Packaging Major Product Offerings
7.1.4 Amkor Technology Fan-out Panel-level Packaging Revenue in Global Market (2018-2023)
7.1.5 Amkor Technology Key News & Latest Developments
7.2 Deca Technologies
7.2.1 Deca Technologies Company Summary
7.2.2 Deca Technologies Business Overview
7.2.3 Deca Technologies Fan-out Panel-level Packaging Major Product Offerings
7.2.4 Deca Technologies Fan-out Panel-level Packaging Revenue in Global Market (2018-2023)
7.2.5 Deca Technologies Key News & Latest Developments
7.3 Lam Research Corporation
7.3.1 Lam Research Corporation Company Summary
7.3.2 Lam Research Corporation Business Overview
7.3.3 Lam Research Corporation Fan-out Panel-level Packaging Major Product Offerings
7.3.4 Lam Research Corporation Fan-out Panel-level Packaging Revenue in Global Market (2018-2023)
7.3.5 Lam Research Corporation Key News & Latest Developments
7.4 Qualcomm Technologies
7.4.1 Qualcomm Technologies Company Summary
7.4.2 Qualcomm Technologies Business Overview
7.4.3 Qualcomm Technologies Fan-out Panel-level Packaging Major Product Offerings
7.4.4 Qualcomm Technologies Fan-out Panel-level Packaging Revenue in Global Market (2018-2023)
7.4.5 Qualcomm Technologies Key News & Latest Developments
7.5 Siliconware Precision Industries
7.5.1 Siliconware Precision Industries Company Summary
7.5.2 Siliconware Precision Industries Business Overview
7.5.3 Siliconware Precision Industries Fan-out Panel-level Packaging Major Product Offerings
7.5.4 Siliconware Precision Industries Fan-out Panel-level Packaging Revenue in Global Market (2018-2023)
7.5.5 Siliconware Precision Industries Key News & Latest Developments
7.6 SPTS Technologies
7.6.1 SPTS Technologies Company Summary
7.6.2 SPTS Technologies Business Overview
7.6.3 SPTS Technologies Fan-out Panel-level Packaging Major Product Offerings
7.6.4 SPTS Technologies Fan-out Panel-level Packaging Revenue in Global Market (2018-2023)
7.6.5 SPTS Technologies Key News & Latest Developments
7.7 STATS ChipPAC
7.7.1 STATS ChipPAC Company Summary
7.7.2 STATS ChipPAC Business Overview
7.7.3 STATS ChipPAC Fan-out Panel-level Packaging Major Product Offerings
7.7.4 STATS ChipPAC Fan-out Panel-level Packaging Revenue in Global Market (2018-2023)
7.7.5 STATS ChipPAC Key News & Latest Developments
7.8 Samsung
7.8.1 Samsung Company Summary
7.8.2 Samsung Business Overview
7.8.3 Samsung Fan-out Panel-level Packaging Major Product Offerings
7.8.4 Samsung Fan-out Panel-level Packaging Revenue in Global Market (2018-2023)
7.8.5 Samsung Key News & Latest Developments
7.9 TSMC
7.9.1 TSMC Company Summary
7.9.2 TSMC Business Overview
7.9.3 TSMC Fan-out Panel-level Packaging Major Product Offerings
7.9.4 TSMC Fan-out Panel-level Packaging Revenue in Global Market (2018-2023)
7.9.5 TSMC Key News & Latest Developments
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer
LIST OF TABLES & FIGURES
List of Tables
Table 1. Fan-out Panel-level Packaging Market Opportunities & Trends in Global Market
Table 2. Fan-out Panel-level Packaging Market Drivers in Global Market
Table 3. Fan-out Panel-level Packaging Market Restraints in Global Market
Table 4. Key Players of Fan-out Panel-level Packaging in Global Market
Table 5. Top Fan-out Panel-level Packaging Players in Global Market, Ranking by Revenue (2022)
Table 6. Global Fan-out Panel-level Packaging Revenue by Companies, (US$, Mn), 2018-2023
Table 7. Global Fan-out Panel-level Packaging Revenue Share by Companies, 2018-2023
Table 8. Global Companies Fan-out Panel-level Packaging Product Type
Table 9. List of Global Tier 1 Fan-out Panel-level Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Fan-out Panel-level Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 11. By Type ? Global Fan-out Panel-level Packaging Revenue, (US$, Mn), 2022 & 2030
Table 12. By Type - Fan-out Panel-level Packaging Revenue in Global (US$, Mn), 2018-2023
Table 13. By Type - Fan-out Panel-level Packaging Revenue in Global (US$, Mn), 2024-2030
Table 14. By Application ? Global Fan-out Panel-level Packaging Revenue, (US$, Mn), 2022 & 2030
Table 15. By Application - Fan-out Panel-level Packaging Revenue in Global (US$, Mn), 2018-2023
Table 16. By Application - Fan-out Panel-level Packaging Revenue in Global (US$, Mn), 2024-2030
Table 17. By Region ? Global Fan-out Panel-level Packaging Revenue, (US$, Mn), 2022 & 2030
Table 18. By Region - Global Fan-out Panel-level Packaging Revenue (US$, Mn), 2018-2023
Table 19. By Region - Global Fan-out Panel-level Packaging Revenue (US$, Mn), 2024-2030
Table 20. By Country - North America Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2023
Table 21. By Country - North America Fan-out Panel-level Packaging Revenue, (US$, Mn), 2024-2030
Table 22. By Country - Europe Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2023
Table 23. By Country - Europe Fan-out Panel-level Packaging Revenue, (US$, Mn), 2024-2030
Table 24. By Region - Asia Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2023
Table 25. By Region - Asia Fan-out Panel-level Packaging Revenue, (US$, Mn), 2024-2030
Table 26. By Country - South America Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2023
Table 27. By Country - South America Fan-out Panel-level Packaging Revenue, (US$, Mn), 2024-2030
Table 28. By Country - Middle East & Africa Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2023
Table 29. By Country - Middle East & Africa Fan-out Panel-level Packaging Revenue, (US$, Mn), 2024-2030
Table 30. Amkor Technology Company Summary
Table 31. Amkor Technology Fan-out Panel-level Packaging Product Offerings
Table 32. Amkor Technology Fan-out Panel-level Packaging Revenue (US$, Mn) & (2018-2023)
Table 33. Amkor Technology Key News & Latest Developments
Table 34. Deca Technologies Company Summary
Table 35. Deca Technologies Fan-out Panel-level Packaging Product Offerings
Table 36. Deca Technologies Fan-out Panel-level Packaging Revenue (US$, Mn) & (2018-2023)
Table 37. Deca Technologies Key News & Latest Developments
Table 38. Lam Research Corporation Company Summary
Table 39. Lam Research Corporation Fan-out Panel-level Packaging Product Offerings
Table 40. Lam Research Corporation Fan-out Panel-level Packaging Revenue (US$, Mn) & (2018-2023)
Table 41. Lam Research Corporation Key News & Latest Developments
Table 42. Qualcomm Technologies Company Summary
Table 43. Qualcomm Technologies Fan-out Panel-level Packaging Product Offerings
Table 44. Qualcomm Technologies Fan-out Panel-level Packaging Revenue (US$, Mn) & (2018-2023)
Table 45. Qualcomm Technologies Key News & Latest Developments
Table 46. Siliconware Precision Industries Company Summary
Table 47. Siliconware Precision Industries Fan-out Panel-level Packaging Product Offerings
Table 48. Siliconware Precision Industries Fan-out Panel-level Packaging Revenue (US$, Mn) & (2018-2023)
Table 49. Siliconware Precision Industries Key News & Latest Developments
Table 50. SPTS Technologies Company Summary
Table 51. SPTS Technologies Fan-out Panel-level Packaging Product Offerings
Table 52. SPTS Technologies Fan-out Panel-level Packaging Revenue (US$, Mn) & (2018-2023)
Table 53. SPTS Technologies Key News & Latest Developments
Table 54. STATS ChipPAC Company Summary
Table 55. STATS ChipPAC Fan-out Panel-level Packaging Product Offerings
Table 56. STATS ChipPAC Fan-out Panel-level Packaging Revenue (US$, Mn) & (2018-2023)
Table 57. STATS ChipPAC Key News & Latest Developments
Table 58. Samsung Company Summary
Table 59. Samsung Fan-out Panel-level Packaging Product Offerings
Table 60. Samsung Fan-out Panel-level Packaging Revenue (US$, Mn) & (2018-2023)
Table 61. Samsung Key News & Latest Developments
Table 62. TSMC Company Summary
Table 63. TSMC Fan-out Panel-level Packaging Product Offerings
Table 64. TSMC Fan-out Panel-level Packaging Revenue (US$, Mn) & (2018-2023)
Table 65. TSMC Key News & Latest Developments
List of Figures
Figure 1. Fan-out Panel-level Packaging Segment by Type in 2022
Figure 2. Fan-out Panel-level Packaging Segment by Application in 2022
Figure 3. Global Fan-out Panel-level Packaging Market Overview: 2022
Figure 4. Key Caveats
Figure 5. Global Fan-out Panel-level Packaging Market Size: 2022 VS 2030 (US$, Mn)
Figure 6. Global Fan-out Panel-level Packaging Revenue, 2018-2030 (US$, Mn)
Figure 7. The Top 3 and 5 Players Market Share by Fan-out Panel-level Packaging Revenue in 2022
Figure 8. By Type - Global Fan-out Panel-level Packaging Revenue Market Share, 2018-2030
Figure 9. By Application - Global Fan-out Panel-level Packaging Revenue Market Share, 2018-2030
Figure 10. By Type - Global Fan-out Panel-level Packaging Revenue, (US$, Mn), 2022 & 2030
Figure 11. By Type - Global Fan-out Panel-level Packaging Revenue Market Share, 2018-2030
Figure 12. By Application - Global Fan-out Panel-level Packaging Revenue, (US$, Mn), 2022 & 2030
Figure 13. By Application - Global Fan-out Panel-level Packaging Revenue Market Share, 2018-2030
Figure 14. By Region - Global Fan-out Panel-level Packaging Revenue Market Share, 2018-2030
Figure 15. By Country - North America Fan-out Panel-level Packaging Revenue Market Share, 2018-2030
Figure 16. US Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 17. Canada Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 18. Mexico Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 19. By Country - Europe Fan-out Panel-level Packaging Revenue Market Share, 2018-2030
Figure 20. Germany Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 21. France Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 22. U.K. Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 23. Italy Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 24. Russia Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 25. Nordic Countries Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 26. Benelux Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 27. By Region - Asia Fan-out Panel-level Packaging Revenue Market Share, 2018-2030
Figure 28. China Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 29. Japan Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 30. South Korea Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 31. Southeast Asia Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 32. India Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 33. By Country - South America Fan-out Panel-level Packaging Revenue Market Share, 2018-2030
Figure 34. Brazil Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 35. Argentina Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 36. By Country - Middle East & Africa Fan-out Panel-level Packaging Revenue Market Share, 2018-2030
Figure 37. Turkey Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 38. Israel Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 39. Saudi Arabia Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 40. UAE Fan-out Panel-level Packaging Revenue, (US$, Mn), 2018-2030
Figure 41. Amkor Technology Fan-out Panel-level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 42. Deca Technologies Fan-out Panel-level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 43. Lam Research Corporation Fan-out Panel-level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 44. Qualcomm Technologies Fan-out Panel-level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 45. Siliconware Precision Industries Fan-out Panel-level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 46. SPTS Technologies Fan-out Panel-level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 47. STATS ChipPAC Fan-out Panel-level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 48. Samsung Fan-out Panel-level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 49. TSMC Fan-out Panel-level Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
