Chip On Film Underfill (COF) Market, Global Outlook and Forecast 2023-2030
Underfills serve the purpose of equalizing stresses between chip and substrate. Chips are attached directly to the interconnection points without intermediate elements. Stresses arise at the solder bumps when the electronic modules are heated and cooled during operation due to the different coefficients of thermal expansion of the substrates. Underfill technology was developed to counteract these mechanical influences. The Chip On Film Underfill (COF) market covers Capillary Underfill (CUF), No Flow Underfill (NUF), Non-Conductive Paste (NCP) Underfill, Non-Conductive Film (NCF) Underfill, Molded Underfill (MUF) Underfill, etc. The typical players include Namics Corporation, AI Technology, Henkel, Shenzhen Dover, Darbond, LORD Corporation, Panacol, Won Chemical, etc.
This report aims to provide a comprehensive presentation of the global market for Chip On Film Underfill (COF), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip On Film Underfill (COF). This report contains market size and forecasts of Chip On Film Underfill (COF) in global, including the following market information:
Global Chip On Film Underfill (COF) Market Revenue, 2018-2023, 2024-2030, ($ millions)
Global Chip On Film Underfill (COF) Market Sales, 2018-2023, 2024-2030, (MT)
Global top five Chip On Film Underfill (COF) companies in 2022 (%)
The global Chip On Film Underfill (COF) market was valued at US$ 371.3 million in 2022 and is projected to reach US$ 461.6 million by 2029, at a CAGR of 3.2% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global Chip On Film Underfill (COF) includes Henkel, Won Chemical, etc. Global top 2 companies hold a share over 43.19%. Asia-Pacific is the largest market, with a share about 49.18%, followed by North America and Europe with the share about 24.91% and 18.09%.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Chip On Film Underfill (COF) manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Chip On Film Underfill (COF) Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (MT)
Global Chip On Film Underfill (COF) Market Segment Percentages, by Type, 2022 (%)
Capillary Underfill (CUF)
No Flow Underfill (NUF)
Non-Conductive Paste (NCP) Underfill
Non-Conductive Film (NCF) Underfill
Molded Underfill (MUF) Underfill
Global Chip On Film Underfill (COF) Market, by Application, 2018-2023, 2024-2030 ($ Millions) & (MT)
Global Chip On Film Underfill (COF) Market Segment Percentages, by Application, 2022 (%)
Cell Phone
Tablet
LCD Display
Other
Global Chip On Film Underfill (COF) Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions) & (MT)
Global Chip On Film Underfill (COF) Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Chip On Film Underfill (COF) revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Chip On Film Underfill (COF) revenues share in global market, 2022 (%)
Key companies Chip On Film Underfill (COF) sales in global market, 2018-2023 (Estimated), (MT)
Key companies Chip On Film Underfill (COF) sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Namics Corporation
AI Technology
Henkel
Dow
Asymptotic Technologies
LORD Corporation
Panacol
Won Chemical
Hitachi Chemical
Shin-Etsu Chemical
AIM Solder
Zymet
Master Bond
Bondline
Alpha Advanced Materials
Outline of Major Chapters:
Chapter 1: Introduces the definition of Chip On Film Underfill (COF), market overview.
Chapter 2: Global Chip On Film Underfill (COF) market size in revenue and volume.
Chapter 3: Detailed analysis of Chip On Film Underfill (COF) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Chip On Film Underfill (COF) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Chip On Film Underfill (COF) capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
